Steven Consiglio

Perspective: New process technologies required for future devices and scaling

Robert D. Clark, Kandabara Tapily, K.H. Yu et al. · APL Materials · 2018 · 180 citations · Full text

Engineering, Device Integration, Process Development +23

Complete band offset characterization of the HfO2/SiO2/Si stack using charge corrected x-ray photoelectron spectroscopy

Eric Bersch, Ming Di, Steven Consiglio et al. · Journal of Applied Physics · 2010 · 132 citations

Hfo2/sio2/si Stack, Engineering, Sio2–si Vbos +18

Antiferroelectric negative capacitance from a structural phase transition in zirconia

Michael Hoffmann, Zheng Wang, Nujhat Tasneem et al. · Nature Communications · 2022 · 58 citations · Full text

Comparison of methods to determine bandgaps of ultrathin HfO2 films using spectroscopic ellipsometry

Ming Di, Eric Bersch, Alain C. Diebold et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2011 · 52 citations

Optical Materials, Engineering, Chemistry +21

The Impacts of Ferroelectric and Interfacial Layer Thicknesses on Ferroelectric FET Design

Nujhat Tasneem, Muhammad Mainul Islam, Zheng Wang et al. · IEEE Electron Device Letters · 2021 · 33 citations

Engineering, Emerging Memory Technology, Ferroelectric Random-access Memory +17