Shang-Chun Chen

Statistics

Publications

Citations

206

H-Index

Active since

2011

Affiliations

Industrial Technology Research Institute(Current)

ITRI International

Shang-Chun Chen is an author at Industrial Technology Research Institute specializing in engineering, semiconductor devices, and integrated circuit design.

Publications per year

2011–2019

Publications

Effects of etch rate on scallop of through-silicon vias (TSVs) in 200mm and 300mm wafers

Yu-Chen Hsin, Chien‐Chou Chen, John H. Lau et al. · 2011 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

Process integration of 3D Si interposer with double-sided active chip attachments

Pei-Jer Tzeng, John H. Lau, Chau‐Jie Zhan et al. · 2013 · 25 citations

Engineering, Electrical Engineering, Microelectronics +16

Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

Jui‐Chin Chen, John H. Lau, Pei-Jer Tzeng et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 24 citations

Engineering, Materials Engineering, Materials Science +14

Fully Symmetric 3-D Transformers With Through-Silicon via IPD Technology for RF Applications

Sih-Han Li, Shawn S. H. Hsu, Kuan-Wei Chen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 21 citations

Engineering, Electrical Engineering, Circuit Theory +16

Oxide Liner, Barrier and Seed Layers, and Cu Plating of Blind Through Silicon Vias (TSVs) on 300 mm Wafers for 3D IC Integration

Chien-Ying Wu, Shang-Chun Chen, Pei-Jer Tzeng et al. · Journal of Microelectronics and Electronic Packaging · 2012 · 19 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

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