Concepedia

Chien-Ying Wu

CW

3

Publications

53

Citations

3

H-Index

2011

Active since

Affiliations

Industrial Technology Research Institute(Current)

Chien-Ying Wu is an author at Industrial Technology Research Institute specializing in microelectronics, microfabrication, and 3d printing.

Top concepts

Publications per year

2011–2013

3

Publications

3

Process integration of 3D Si interposer with double-sided active chip attachments

Pei-Jer Tzeng, John H. Lau, Chau‐Jie Zhan et al. · 2013 · 24 citations

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Oxide Liner, Barrier and Seed Layers, and Cu Plating of Blind Through Silicon Vias (TSVs) on 300 mm Wafers for 3D IC Integration

Chien-Ying Wu, Shang-Chun Chen, Pei-Jer Tzeng et al. · Journal of Microelectronics and Electronic Packaging · 2012 · 17 citations · Full text

, , +17

Oxide Liner, Barrier and Seed Layers, and Cu-Plating of Blind Through Silicon Vias (TSVs) on 300mm Wafers for 3D IC Integration

Chien-Ying Wu, Shang-Chun Chen, Pei-Jer Tzeng et al. · IMAPSource Proceedings · 2011 · 12 citations

, , +17

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