Concepedia

Margie Li

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Statistics

Publications

13

Citations

528

H-Index

12

Active since

2014

Affiliations

ASM Pacific Technology (China)(Current)

Indium Corporation (United States)

Hong Kong University of Science and Technology

Micron Corporation (United States)

Dow Chemical (United States)

Margie Li is an author at ASM Pacific Technology (China) specializing in electronic packaging, engineering, and microelectronics.

Top concepts

EngineeringElectronic PackagingMicroelectronicsElectrical EngineeringHeat TransferComputer EngineeringMicrofabrication3D PrintingMaterial ScienceThree-dimensional Heterogeneous Integration

Publications per year

2014–2018

13

Publications

13

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 147 citations

Electrical Engineering, Chip-scale Package, Engineering +15

Targeted Disruption of β-Arrestin 2-Mediated Signaling Pathways by Aptamer Chimeras Leads to Inhibition of Leukemic Cell Growth

Jonathan W. Kotula, Jin‐Peng Sun, Margie Li et al. · PLoS ONE · 2014 · 49 citations · Full text

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, John H. Lau, Ming Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 47 citations

Engineering, Energy Efficiency, Computer Architecture +16

Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers

John H. Lau, Ming Li, Lei Yang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 46 citations

Engineering, Mechanical Engineering, Fowlp Fabrication +19

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · 2017 · 44 citations

Electrical Engineering, Chip Size, Engineering +15

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