Hessel Sprey

Characterization and optimization of porogen-based PECVD deposited extreme low-k materials as a function of UV-cure time

Patrick Verdonck, David De Roest, Shinya Kaneko et al. · Surface and Coatings Technology · 2007 · 51 citations

Natural Sciences, Materials Engineering, Materials Science +10

Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects

Gerald Beyer, A. Satta, Jörg Schuhmacher et al. · Microelectronic Engineering · 2002 · 44 citations

Engineering, Materials Engineering, Materials Science +14

Low temperature plasma-enhanced ALD enables cost-effective spacer defined double patterning (SDDP)

Julien Beynet, Patrick Wong, Andy Miller et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2009 · 33 citations

Natural Sciences, Materials Engineering, Materials Science +16

A robust k∼2.3 SiCOH low-k film formed by porogen removal with UV-cure

Nathan Kemeling, Kiyohiro Matsushita, Naoto Tsuji et al. · Microelectronic Engineering · 2007 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +4

Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance

P. Maršík, Adam Urbanowicz, Patrick Verdonck et al. · Thin Solid Films · 2011 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +13