Concepedia

Andrew Mawer

AM

11

Publications

269

Citations

10

H-Index

1995

Active since

Affiliations

Motorola (United States)(Current)

Amkor Technology (United States)

Andrew Mawer is an author at Motorola (United States) specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMaterial ScienceMicroelectronicsMechanical EngineeringCorrosionMaterials EngineeringComputer-aided DesignReliability Engineering

Publications per year

1995–2014

11

Publications

11

Solder joint fatigue life of fine pitch BGAs – impact of design and material choices

Robert Darveaux, Jim Heckman, Ahmer Syed et al. · Microelectronics Reliability · 2000 · 45 citations

Materials Science, Industrial Design, Engineering +5

Impact of solder pad size on solder joint reliability in flip chip PBGA packages

L.L. Mercado, V. Sarihan, Yifan Guo et al. · IEEE Transactions on Advanced Packaging · 2000 · 35 citations

Reliability, Package Reliability, Electrical Engineering +13

Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications

Andrew Mawer, Nick Vo, Z. Johnson et al. · 2003 · 30 citations

Engineering, Ball Pitch, Reliability Engineering +16

The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version)

Richard Coyle, Diane E. Hodges Popps, Andrew Mawer et al. · IEEE Transactions on Components and Packaging Technologies · 2003 · 28 citations

Materials Science, Electrical Engineering, Engineering +14

Copper versus palladium coated copper wire process and reliability differences

Chu-Chung Stephen Lee, Tu-Anh Tran, D.M. Boyne et al. · 2014 · 27 citations

Materials Science, Materials Engineering, Electrical Engineering +9

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