Concepedia

Z. Johnson

ZJ

8

Publications

218

Citations

8

H-Index

2002

Active since

Affiliations

Motorola (United States)(Current)

Z. Johnson is an author at Motorola (United States) specializing in engineering, thermal engineering, and electronic packaging.

Top concepts

EngineeringThermal EngineeringElectronic PackagingElectrical EngineeringHeat TransferMicroelectronicsThermal ModelingMechanical EngineeringReliability EngineeringRefrigeration

Publications per year

2002–2015

8

Publications

8

Implementation of and extensions to Darveaux's approach to finite-element simulation of BGA solder joint reliability

Z. Johnson · 2003 · 41 citations

Engineering, Mechanical Engineering, Mechanics Of Materials +20

Selective thermal emission from patterned steel

J. A. Mason, David C. Adams, Z. Johnson et al. · Optics Express · 2010 · 33 citations · Full text

Optical Materials, Engineering, High Strength Low Alloy Steel +17

Underfilled BGAs for ceramic BGA packages and board-level reliability

Terry Burnette, Z. Johnson, Thomas Koschmieder et al. · 2002 · 33 citations

Engineering, Mechanical Engineering, Reliability Engineering +17

Thermal sub-modeling of the wirebonded plastic ball grid array package

Z. Johnson, K. Ramakrishna, B. Joiner et al. · 2002 · 32 citations

Engineering, Mechanical Engineering, Refrigeration +18

Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications

Andrew Mawer, Nick Vo, Z. Johnson et al. · 2003 · 30 citations

Engineering, Ball Pitch, Reliability Engineering +16

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