Concepedia

B. Joiner

BJ

6

Publications

107

Citations

6

H-Index

1976

Active since

Affiliations

Motorola (United States)(Current)

ON Semiconductor (United States)

B. Joiner is an author at Motorola (United States) specializing in engineering, thermodynamics, and thermal modeling.

Top concepts

EngineeringThermodynamicsHeat TransferThermal ModelingThermal EngineeringElectronic PackagingElectrical EngineeringRefrigerationMicroelectronicsThermal Management

Publications per year

1976–2009

6

Publications

6

Thermal sub-modeling of the wirebonded plastic ball grid array package

Z. Johnson, K. Ramakrishna, B. Joiner et al. · 2002 · 32 citations

Engineering, Mechanical Engineering, Refrigeration +18

Measurement and simulation of junction to board thermal resistance and its application in thermal modeling

B. Joiner, V. Adams · 2003 · 24 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +15

Measurement and simulation of stacked die thermal resistances

B. Joiner, Jiang De, S. Neelakantan · 2006 · 15 citations

Engineering, Advanced Packaging (Semiconductors), Jedec 51 +16

THERMAL MODEL OF A COMPONENT PACKAGE FOR SYSTEM LEVEL APPLICATIONS

Sue Teng, Tien‐Yu Tom Lee, Mali Mahalingam et al. · Journal of Electronics Manufacturing · 1997 · 14 citations

Engineering, Industrial Engineering, Energy Efficiency +25

Glass transition temperature shift under pressure for some semiconducting glasses

B. Joiner, J.C. Thompson · Journal of Non-Crystalline Solids · 1976 · 12 citations

Materials Science, Engineering, Physics +7

Rows per page

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