L. Pinzelli

28nm FDSOI technology platform for high-speed low-voltage digital applications

N. Planes, O. Weber, V. Barral et al. · 2012 · 424 citations

Engineering, Computer Engineering, Electrical Engineering +16

A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

S. Crémer, Nathalie Vulliet, Thierry Pinguet et al. · 2013 · 95 citations

Engineering, Electrical Engineering, Optoelectronics +16

Efficient multi-V<inf>T</inf> FDSOI technology with UTBOX for low power circuit design

C. Fenouillet-Béranger, Olivier Thomas, P. Perreau et al. · 2010 · 70 citations

Engineering, Computer Engineering, Electrical Engineering +8

Impact of a 10nm ultra-thin BOX (UTBOX) and ground plane on FDSOI devices for 32nm node and below

C. Fenouillet-Béranger, P. Perreau, S. Denorme et al. · Solid-State Electronics · 2010 · 64 citations

Engineering, Computer Engineering, Electrical Engineering +17

<i>In situ</i> electric field simulation in metal/insulator/metal capacitors

Nicolas Gaillard, L. Pinzelli, M. Gros‐Jean et al. · Applied Physics Letters · 2006 · 63 citations

Natural Sciences, Electrical Engineering, Materials Science +14