Frédéric Lazzarino

Direct metal etch of ruthenium for advanced interconnect

Sara Paolillo, Danny Wan, Frédéric Lazzarino et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2018 · 53 citations

Engineering, Pattern Transfer, Solid-state Chemistry +17

Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below

Stefan Decoster, Elisabeth Camerotto, Gayle Murdoch et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2022 · 38 citations

Engineering, Pattern Transfer, Solid-state Chemistry +18

Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling

Anshul Gupta, Olalla Varela Pedreira, Goutham Arutchelvan et al. · IEEE Transactions on Electron Devices · 2020 · 36 citations

Engineering, Vlsi Design, Integrated Circuits +16

Subtractive Etch of Ruthenium for Sub-5nm Interconnect

Danny Wan, Sara Paolillo, Nouredine Rassoul et al. · 2018 · 29 citations

Materials Science, Electrical Engineering, Material Analysis +14

Printing the metal and contact layers for the 32- and 22-nm node: comparing positive and negative tone development process

Lieve Van Look, Joost Bekaert, Vincent Truffert et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2010 · 28 citations

Contact Patterning, Engineering, Electron-beam Lithography +21