Statistics
Publications
4
Citations
123
H-Index
4
Active since
2007
Hsing-Hui Wu is an author at Hong Kong University of Science and Technology specializing in engineering, packaging design, and electronic materials.
Publications per year
2007–2018
4
4
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Cheng-Ta Ko, Chieh-Lin Chang, Jhih-Yuan Pan et al. · 2018 · 35 citations
Engineering, Electrical Engineering, Materials Engineering +17
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