F. Bailly

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 90 citations

Engineering, Image Sensor, Cmos Image Sensor +16

Roughening of porous SiCOH materials in fluorocarbon plasmas

F. Bailly, T. Chevolleau, Maxime Darnon et al. · Journal of Applied Physics · 2010 · 29 citations · Full text

Materials Science, Materials Engineering, Ion Implantation +15

Patterning of narrow porous SiOCH trenches using a TiN hard mask

Maxime Darnon, T. Chevolleau, David Eon et al. · Microelectronic Engineering · 2008 · 27 citations · Full text

Pore Structure, Tin Hard Mask, Engineering +2

Patterning of porous SiOCH using an organic mask: Comparison with a metallic masking strategy

Maxime Darnon, T. Chevolleau, J. Ducoté et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2010 · 15 citations

Engineering, Electron-beam Lithography, Porous Membrane +23