E. Lajoinie

Challenge of ashing and cleaning on SiOC-H dielectric: characterization and main issues

O. Louveau, D. Louis, M. Assous et al. · Microelectronic Engineering · 2002 · 18 citations

Materials Engineering, Materials Science, Electrical Engineering +6

Improved post etch cleaning for low-k and copper integration for 0.18μm technology

D. Louis, C. Peyne, E. Lajoinie et al. · Microelectronic Engineering · 1999 · 17 citations

Electrical Engineering, Chemical Engineering, Engineering +8

Post etch cleaning of low-k dielectric materials for advanced interconnects: Characterization and process optimization

D. Louis, E. Lajoinie, F. Pires et al. · Microelectronic Engineering · 1998 · 15 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Ultrahigh-resolution pattern using electron-beam lithography HF wet etching

Raluca Tiron, L. Mollard, O. Louveau et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2007 · 14 citations

Materials Science, Resist Trimming, Ultrahigh-resolution Pattern +15

Cleaning status on low-k dielectric in advanced VLSI interconnect:

D. Louis, Alessio Beverina, C. Arvet et al. · Microelectronic Engineering · 2001 · 12 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +8