Concepedia

Aakrati Jain

AJ

Statistics

Publications

4

Citations

76

H-Index

4

Active since

2021

Affiliations

IBM Research - Tokyo(Current)

IBM (United States)

Aakrati Jain is an author at IBM Research - Tokyo specializing in mechanical engineering, microelectronics, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingMechanical EngineeringThree-dimensional Heterogeneous Integration3D PrintingApplied PhysicsComputer EngineeringHeterogeneous Integration

Publications per year

2021–2023

4

Publications

4

Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

Kamal Sikka, Ravi Bonam, Yang Liu et al. · 2021 · 43 citations

Robust Assembly Process, Dbhi Package, Bridge Design +14

Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

Aakrati Jain, Kamal Sikka, Juan-Manuel Gomez et al. · 2021 · 12 citations

3D Ic Architecture, Wafer Scale Processing, Engineering +13

Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications

Aakrati Jain, Risa Miyazawa, Sathya Raghavan et al. · 2023 · 11 citations

Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages

Akihiro Horibe, Chinami Marushima, Takahito Watanabe et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 10 citations

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