Sathya Raghavan

Voids-free Die-level Cu/ILD Hybrid bonding

Katsuyuki Sakuma, Roy Yu, Nicholas A. Polomoff et al. · 2023 · 14 citations

Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications

Aakrati Jain, Risa Miyazawa, Sathya Raghavan et al. · 2023 · 11 citations

Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process

Prabudhya Roy Chowdhury, Katsuyuki Sakuma, Sathya Raghavan et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 10 citations