Risa Miyazawa

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Chinami Marushima, Toyohiro Aoki, Koki Nakamura et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 11 citations

Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications

Aakrati Jain, Risa Miyazawa, Sathya Raghavan et al. · 2023 · 11 citations