Concepedia

Juan-Manuel Gomez

JG

Statistics

Publications

3

Citations

37

H-Index

3

Active since

2021

Affiliations

ASM Pacific Technology (China)(Current)

Juan-Manuel Gomez is an author at ASM Pacific Technology (China) specializing in mechanical engineering, three-dimensional heterogeneous integration, and applied physics.

Top concepts

Publications per year

2021–2022

3

Publications

3

Surface Energy Characterization for Die-Level Cu Hybrid Bonding

Katsuyuki Sakuma, Roy Yu, Michael Belyansky et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 14 citations

Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

Aakrati Jain, Kamal Sikka, Juan-Manuel Gomez et al. · 2021 · 12 citations

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Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration

Katsuyuki Sakuma, Dishit P. Parekh, Michael Belyansky et al. · 2021 · 11 citations

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