B. van Schravendijk

Copper interconnects for semiconductor devices

Sailesh M. Merchant, Seung H. Kang, Mahesh K. Sanganeria et al. · JOM · 2001 · 45 citations

Semiconductors, Electrical Engineering, Wafer Scale Processing +6

Single polysilicon layer advanced super high-speed BiCMOS technology

J.L. de Jong, R. Lane, B. van Schravendijk et al. · 2003 · 33 citations

Electrical Engineering, Engineering, High-speed Electronics +12

Cu surface treatment influence on Si adsorption properties of CuSiN self-aligned barriers for sub-65nm technology node

S. Chhun, L.G. Gosset, J. Michelon et al. · Microelectronic Engineering · 2006 · 18 citations

Materials Engineering, Materials Science, Surface Characterization +12

In-situ Formation of a Copper Silicide Cap For TDDB and Electromigration Improvement

Kalyan Kumar Chattopadhyay, B. van Schravendijk, Tom Mountsier et al. · 2006 · 12 citations

Engineering, Copper Silicide Cap, Chemistry +20

Integrated approach to improving local CD uniformity in EUV patterning

Andrew Liang, Jan Hermans, Timothy H. Tran et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2017 · 12 citations

Optical Materials, Engineering, Electron-beam Lithography +18