S. Chhun

14nm FDSOI technology for high speed and energy efficient applications

O. Weber, E. Josse, F. Andrieu et al. · 2014 · 89 citations

Engineering, Computer Engineering, Electrical Engineering +15

New insights on bottom layer thermal stability and laser annealing promises for high performance 3D VLSI

C. Fenouillet-Béranger, B. Mathieu, B. Prévitali et al. · 2014 · 56 citations

Engineering, Electrical Engineering, Materials Science +17

14nm FDSOI upgraded device performance for ultra-low voltage operation

O. Weber, E. Josse, J. Mazurier et al. · 2015 · 33 citations

Engineering, Computer Engineering, Electrical Engineering +17

Characterization of electrical and crystallographic properties of metal layers at deca-nanometer scale using Kelvin probe force microscope

Nicolas Gaillard, D. Mariolle, F. Bertin et al. · Microelectronic Engineering · 2006 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +17

Influence of SiH4 process step on physical and electrical properties of advanced copper interconnects

S. Chhun, L.G. Gosset, N. Casanova et al. · Microelectronic Engineering · 2004 · 23 citations

Engineering, Materials Engineering, Materials Science +16