Influence of SiH4 process step on physical and electrical properties of advanced copper interconnects - Concepedia

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Influence of SiH4 process step on physical and electrical properties of advanced copper interconnects

23

Citations

5

References

2004

Year

S. Chhun, L.G. Gosset, N. Casanova, J.F. Guillaumond, P. Dumont-Girard, X. Federspiel, R. Pantel, V. Arnal, L. Arnaud, J. Torrès

Microelectronic Engineering

Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringNanoelectronicsApplied PhysicsSih4 Process StepAdvanced Copper InterconnectsSemiconductor Device FabricationMicroelectronicsElectrical PropertiesInterconnect (Integrated Circuits)

References

	Year	Citations

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