Tom Mountsier

Resistivity dominated by surface scattering in sub-50 nm Cu wires

Rebekah L. Graham, G. B. Alers, Tom Mountsier et al. · Applied Physics Letters · 2010 · 159 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Copper interconnects for semiconductor devices

Sailesh M. Merchant, Seung H. Kang, Mahesh K. Sanganeria et al. · JOM · 2001 · 46 citations

Engineering, Electrical Engineering, Materials Science +14

Patterning with Amorphous Carbon Thin Films

G. A. Antonelli, Sirish K. Reddy, Pramod Subramonium et al. · ECS Transactions · 2011 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +17

Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

G. A. Antonelli, Gengwei Jiang, Roey Shaviv et al. · Microelectronic Engineering · 2011 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +16

Work function tuning of plasma-enhanced atomic layer deposited WCxNy electrodes for metal/oxide/semiconductor devices

Oren Zonensain, Sivan Fadida, Ilanit Fisher et al. · Applied Physics Letters · 2015 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +17