Tom Mountsier

Resistivity dominated by surface scattering in sub-50 nm Cu wires

Rebekah L. Graham, G. B. Alers, Tom Mountsier et al. · Applied Physics Letters · 2010 · 153 citations

Materials Science, Surface Characterization, Electrical Engineering +15

Copper interconnects for semiconductor devices

Sailesh M. Merchant, Seung H. Kang, Mahesh K. Sanganeria et al. · JOM · 2001 · 45 citations

Semiconductors, Electrical Engineering, Wafer Scale Processing +6

Patterning with Amorphous Carbon Thin Films

G. A. Antonelli, Sirish K. Reddy, Pramod Subramonium et al. · ECS Transactions · 2011 · 20 citations

Materials Science, Engineering, Carbon-based Material +12

Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

G. A. Antonelli, Gengwei Jiang, Roey Shaviv et al. · Microelectronic Engineering · 2011 · 17 citations

Materials Science, Electrical Engineering, Synergistic Combinations +12

Work function tuning of plasma-enhanced atomic layer deposited WCxNy electrodes for metal/oxide/semiconductor devices

Oren Zonensain, Sivan Fadida, Ilanit Fisher et al. · Applied Physics Letters · 2015 · 16 citations

Engineering, Work Function, Vacuum Device +18