Mansour Moinpour

Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions

Stephen W. Russell, S.A. Rafalski, R.L. Spreitzer et al. · Thin Solid Films · 1995 · 141 citations

Natural Sciences, Materials Engineering, Materials Science +16

Mechanistic study of plasma damage of low k dielectric surfaces

J. Bao, Hua‐Tian Shi, J. Liu et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2008 · 102 citations

Natural Sciences, Materials Engineering, Materials Science +15

Composite Polymer Core–Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study

Silvia Armini, Joke De Messemaeker, Caroline M. Whelan et al. · Journal of The Electrochemical Society · 2008 · 101 citations

Natural Sciences, Materials Engineering, Materials Science +17

Physical, chemical, and in vitro toxicological characterization of nanoparticles in chemical mechanical planarization suspensions used in the semiconductor industry: towards environmental health and safety assessments

David Speed, Paul Westerhoff, Reyes Sierra‐Álvarez et al. · Environmental Science Nano · 2015 · 76 citations

Natural Sciences, Chemical Engineering, Toxicology +17

Composite Polymer-Core Silica-Shell Abrasive Particles during Oxide CMP

Silvia Armini, Caroline M. Whelan, Karen Maex et al. · Journal of The Electrochemical Society · 2007 · 57 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16