Concepedia

Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions

Stephen W. Russell, S.A. Rafalski, R.L. Spreitzer, J. Li, Mansour Moinpour, Farhad Moghadam, T. L. Alford

Thin Solid Films · 1995 · 141 citations · 35 references

DOI

Concepts

References

35

Diffusion of Metals in Silicon Dioxide

J. D. McBrayer, R.M. Swanson, T. W. Sigmon · Journal of The Electrochemical Society · 1986 · 528 citations

, , +17

Reaction of thin metal films with SiO2 substrates

R. Pretoriüs, Joel M. Harris, M.−A. Nicolet · Solid-State Electronics · 1978 · 300 citations

, , +12

Oxidation and protection in copper and copper alloy thin films

Jian Li, J. W. Mayer, E. G. Colgan · Journal of Applied Physics · 1991 · 257 citations

, , +17

Copper Transport in Thermal SiO2

Yosi Shacham‐Diamand, A. Dedhia, D. Hoffstetter et al. · Journal of The Electrochemical Society · 1993 · 241 citations

, , +17

Stress development and relaxation in copper films during thermal cycling

M.D. Thouless, J. Gupta, J. M. E. Harper · Journal of materials research/Pratt's guide to venture capital sources · 1993 · 213 citations

, , +16