Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions - Concepedia

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Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions

137

Citations

35

References

1995

Year

Stephen W. Russell, S.A. Rafalski, R.L. Spreitzer, J. Li, Mansour Moinpour, Farhad Moghadam, T. L. Alford

Thin Solid Films

Materials ScienceChemical EngineeringElectromigration TechniqueEngineeringSacrificial ReactionsSurface ScienceMetallic Functional MaterialChromium AdditionsEnhanced AdhesionHigh-performance MaterialMetallic Nanomaterials

References

	Year	Citations

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