Physical, chemical, and in vitro toxicological characterization of nanoparticles in chemical mechanical planarization suspensions used in the semiconductor industry: towards environmental health and safety assessments

David Speed, Paul Westerhoff, Reyes Sierra‐Álvarez, Rockford K. Draper, Paul Pantano, Shyam Aravamudhan, Kai Loon Chen, Kiril Hristovski, Pierre Herckès, Xiangyu Bi,

Environmental Science Nano · 2015 · 76 citations · 68 references

Concepts

Abstract

This tutorial review focuses on aqueous slurries of dispersed engineered nanoparticles (ENPs) used in chemical mechanical planarization (CMP) for polishing wafers during manufacturing of semiconductors.

References

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