D. Questad

Chip-Package-Interaction Modeling of Ultra Low-k/Copper Back End of Line

X. H. Liu, T. M. Shaw, Michael Lane et al. · 2007 · 55 citations

Engineering, Materials Engineering, Materials Science +17

Underfill Selection Strategy for Pb-Free, Low-K and Fine Pitch Organic Flip Chip Applications

M.-C. Paquet, Michael Gaynes, Éric Duchesne et al. · 2006 · 37 citations

Engineering, Electrical Engineering, Materials Science +17

Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy

Lorenzo Valdevit, Vivek Khanna, Abhishek Sharma et al. · Microelectronics Reliability · 2007 · 26 citations

Engineering, Materials Engineering, Materials Science +16

Chip-to-package interaction for a 90 nm Cu / PECVD low-k technology

W. Landers, D. Edelstein, L. A. Clevenger et al. · 2004 · 25 citations

Engineering, Electrical Engineering, Materials Science +15

Adhesion issues in flip-chip on organic modules

S. Tran, D. Questad, Bahgat Sammakia · IEEE Transactions on Components and Packaging Technologies · 1999 · 24 citations

Engineering, Materials Engineering, Materials Science +17