Statistics
Publications
2
Citations
40
H-Index
2
Active since
1999
Affiliations
Binghamton University(Current)
S. Tran is an author at Binghamton University specializing in advanced packaging, underfill materials, and chip packaging.
Publications per year
1999–2005
2
2
Flip chip assembly challenges using high density, thin core carriers
Virendra Jadhav, S.P. Moore, C. Palomaki et al. · 2005 · 16 citations
Engineering, Manufacturing Engineering, Materials Engineering +17
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