Statistics
Publications
3
Citations
42
H-Index
3
Active since
2005
Affiliations
IBM (United States)(Current)
S.P. Moore is an author at IBM (United States) specializing in materials engineering, electronic materials, and packaging design.
Publications per year
2005–2013
3
3
Flip chip assembly challenges using high density, thin core carriers
Virendra Jadhav, S.P. Moore, C. Palomaki et al. · 2005 · 16 citations
Engineering, Manufacturing Engineering, Materials Engineering +17
Development of a Low CTE chip scale package
Tomoyuki Yamada, Masahiro Fukui, Kenji Terada et al. · 2013 · 12 citations
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