Statistics
Publications
3
Citations
38
H-Index
3
Active since
2005
Affiliations
Endicott College(Current)
Virendra Jadhav is an author at Endicott College specializing in packaging design, semiconductor reliability, and materials engineering.
Publications per year
2005–2009
3
3
Flip chip assembly challenges using high density, thin core carriers
Virendra Jadhav, S.P. Moore, C. Palomaki et al. · 2005 · 16 citations
Engineering, Manufacturing Engineering, Materials Engineering +17
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