Statistics
Publications
1
Citations
16
H-Index
1
Active since
2005
Affiliations
Endicott College(Current)
C. Palomaki is an author at Endicott College specializing in chip packaging, advanced packaging, and underfill materials.
Publications per year
2005–2005
1
1
Flip chip assembly challenges using high density, thin core carriers
Virendra Jadhav, S.P. Moore, C. Palomaki et al. · 2005 · 16 citations
Engineering, Manufacturing Engineering, Materials Engineering +17
1–1 of 1