Concepedia

T. Thomas

TT

Statistics

Publications

12

Citations

370

H-Index

11

Active since

2010

Affiliations

Technische Universität Berlin(Current)

Fraunhofer Institute for Reliability and Microintegration

Robert Bosch (Germany)

Children's Hospital of Philadelphia

Columbia University

T. Thomas is an author at Technische Universität Berlin specializing in engineering, microfabrication, and electronic packaging.

Top concepts

EngineeringMicrofabricationAdvanced PackagingElectronic PackagingMicroelectronicsIntegrated CircuitsBiomedical EngineeringComputer-aided DesignMedicine3D Printing

Publications per year

2010–2022

12

Publications

12

Large area compression molding for Fan-out Panel Level Packing

Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 76 citations

Advanced Packaging, Chip-scale Package, Engineering +15

Modification of cell structure and mass transfer in potato tissue by contact ultrasound

Katharina Schössler, T. Thomas, Dietrich Knorr · Food Research International · 2012 · 71 citations

Cell Structure, Engineering, Sonoelectrochemistry +10

From wafer level to panel level mold embedding

Tanja Braun, K.-F. Becker, S. Voges et al. · 2013 · 44 citations

Through mold vias for stacking of mold embedded packages

Tanja Braun, K.-F. Becker, S. Voges et al. · 2011 · 40 citations

Large Area, Engineering, Mechanical Engineering +23

Large area embedding for heterogeneous system integration

Tanja Braun, K.-F. Becker, L. Böttcher et al. · 2010 · 25 citations

Large Area, Cluster Computing, Transfer Molding +23

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