Cory S. Wajda

Perspective: New process technologies required for future devices and scaling

Robert D. Clark, Kandabara Tapily, K.H. Yu et al. · APL Materials · 2018 · 180 citations · Full text

Engineering, Device Integration, Process Development +23

Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

S-A. Chew, Hao Yu, Marc Schaekers et al. · 2017 · 30 citations

Engineering, Ald-ti Contact Metal, Nanoelectronics +17

Comparison of B2O3 and BN deposited by atomic layer deposition for forming ultrashallow dopant regions by solid state diffusion

Steven Consiglio, Robert D. Clark, David O’Meara et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2015 · 24 citations

Materials Science, Dopant Source, Boron Nitride +15

Deep learning acceleration in 14nm CMOS compatible ReRAM array: device, material and algorithm co-optimization

Nanbo Gong, Malte J. Rasch, Soon‐Cheon Seo et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 22 citations

Engineering, Machine Learning, Hardware Acceleration +12

Atomic layer deposited ultrathin metal nitride barrier layers for ruthenium interconnect applications

Sonal Dey, Kai-Hung Yu, Steven Consiglio et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2017 · 21 citations · Full text

Engineering, Chemical Deposition, Atomic Layer +18