Shang-Hung Shen

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Active since

2011

Affiliations

Industrial Technology Research Institute(Current)

ITRI International

Shang-Hung Shen is an author at Industrial Technology Research Institute specializing in semiconductor devices, through-silicon vias, and materials science.

Publications per year

2011–2012

Publications

Effects of etch rate on scallop of through-silicon vias (TSVs) in 200mm and 300mm wafers

Yu-Chen Hsin, Chien‐Chou Chen, John H. Lau et al. · 2011 · 39 citations

Engineering, Electrical Engineering, Materials Science +17

Oxide Liner, Barrier and Seed Layers, and Cu Plating of Blind Through Silicon Vias (TSVs) on 300 mm Wafers for 3D IC Integration

Chien-Ying Wu, Shang-Chun Chen, Pei-Jer Tzeng et al. · Journal of Microelectronics and Electronic Packaging · 2012 · 19 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Impact of slurry in Cu CMP (chemical mechanical polishing) on Cu topography of Through Silicon Vias (TSVs), re-distribution layers, and Cu exposure

J. C. Chen, P. J. Tzeng, Sheng‐Chih Chen et al. · 2011 · 18 citations

Engineering, Materials Engineering, Materials Science +16

Oxide Liner, Barrier and Seed Layers, and Cu-Plating of Blind Through Silicon Vias (TSVs) on 300mm Wafers for 3D IC Integration

Chien-Ying Wu, Shang-Chun Chen, Pei-Jer Tzeng et al. · IMAPSource Proceedings · 2011 · 12 citations

Engineering, Electrical Engineering, Materials Science +17

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