Yong Kong Siew

First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers

S. Subramanian, M. Reza Hosseini, T. Chiarella et al. · 2020 · 109 citations

Engineering, N14 Platform, Interconnect (Integrated Circuits) +16

Alternative metals for advanced interconnects

Christoph Adelmann, Liang Wen, Antony Premkumar Peter et al. · 2014 · 87 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Thermal Curing of Hydrogen Silsesquioxane

Yong Kong Siew, G. Sarkar, Xiao Hu et al. · Journal of The Electrochemical Society · 2000 · 74 citations

Engineering, Experimental Thermodynamics, Chemistry +18

65nm cmos technology for low power applications

An Steegen, R. Mo, R. Mann et al. · 2006 · 44 citations

Low-power Electronics, Low Power Applications, Electrical Engineering +13

Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling

Anshul Gupta, Olalla Varela Pedreira, Goutham Arutchelvan et al. · IEEE Transactions on Electron Devices · 2020 · 36 citations

Engineering, Vlsi Design, Integrated Circuits +16