E. Levine

A four-level VLSI bipolar metallization design with chemical-mechanical planarization

W. L. Guthrie, W. Patrick, E. Levine et al. · IBM Journal of Research and Development · 1992 · 29 citations

Engineering, Integrated Circuits, Four-level Wiring +18

Analysis of Thermal Cycle Fatigue Damage in Microsocket Solder Joints

E. Levine, Juan S. Ordonez · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1981 · 26 citations

Engineering, Mechanical Engineering, Structural Materials +17

Electromigration improvements with titanium underlay and overlay in Al(Cu) metallurgy

J.J. Estabil, H. Rathore, E. Levine · 2002 · 23 citations

Engineering, Interconnect (Integrated Circuits), Anodizing +16

Electromigration Induced Damage and Structure Change in Cr-Al/Cu and Al/Cu Interconnection Lines

E. Levine, J. Kitcher · Reliability physics · 1984 · 21 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +24

MRC for curvilinear mask shapes

Ingo Bork, Alexander Tritchkov, Shumay Shang et al. · 2020 · 16 citations