Concepedia

J.J. Estabil

JE

3

Publications

48

Citations

3

H-Index

1993

Active since

Affiliations

IBM (United States)(Current)

IBM Research - Thomas J. Watson Research Center

J.J. Estabil is an author at IBM (United States) specializing in electronic packaging, engineering, and electrical engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingMaterials EngineeringElectrical EngineeringCorrosionMicrostructureApplied PhysicsMaterial ScienceElectrochemistry

Publications per year

1993–2002

3

Publications

3

Electromigration improvements with titanium underlay and overlay in Al(Cu) metallurgy

J.J. Estabil, H. Rathore, E. Levine · 2002 · 23 citations

Engineering, Interconnect (Integrated Circuits), Anodizing +16

Electromigration in a two-level Al-Cu interconnection with W studs

Thomas Kwok, Cher Ming Tan, D. Moy et al. · 2002 · 13 citations

Materials Engineering, Aluminium Nitride, Electrical Engineering +10

<title>Electromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud via interconnections</title>

Hazara S. Rathore, R. G. Filippi, R. Wachnik et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1993 · 12 citations

Engineering, Current-carrying Implications, Corrosion +16

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