W. Cote

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 350 citations

3D Ic Architecture, Electrical Engineering, Cu Wiring +8

Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing

Howard Landis, Peter J. Burke, W. Cote et al. · Thin Solid Films · 1992 · 104 citations

Materials Science, Wafer Scale Processing, Engineering +7

Dual Damascene: a ULSI wiring technology

Carter Kaanta, S.G. Bombardier, W. Cote et al. · 2002 · 91 citations

Insulator Matrix, Engineering, Device Integration +19

Low-temperature chemical vapor deposition processes and dielectrics for microelectronic circuit manufacturing at IBM

D. Cote, S. Nguyen, W. Cote et al. · IBM Journal of Research and Development · 1995 · 39 citations

Dielectric Planarization, Engineering, Multilevel Microelectronic Circuits +16

Submicron wiring technology with tungsten and planarization

Carter Kaanta, W. Cote, John Cronin et al. · 1987 · 28 citations

Electrical Engineering, Complementary Insulator, Engineering +13