Concepedia

Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing

Howard Landis, Peter J. Burke, W. Cote, William R. Hill, Cheryl Hoffman, Carter Kaanta, Charles W. Koburger, Walter Lange, Micheal Leach, S.L. Luce

Thin Solid Films · 1992 · 104 citations · 5 references

DOI

Concepts

References

5

Chemical processes in glass polishing

Lee M. Cook · Journal of Non-Crystalline Solids · 1990 · 989 citations

, , +11

Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects

F. B. Kaufman, Daniel B. Thompson, R. E. Broadie et al. · Journal of The Electrochemical Society · 1991 · 511 citations

, , +17

Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit Interconnections

W. Patrick, W. L. Guthrie, C. L. Standley et al. · Journal of The Electrochemical Society · 1991 · 237 citations

, , +17

Sub-μm, planarized, Nb-AlO<i>x</i>-Nb Josephson process for 125 mm wafers developed in partnership with Si technology

M. B. Ketchen, D.J. Pearson, A. W. Kleinsasser et al. · Applied Physics Letters · 1991 · 108 citations

, , +17

A Two‐Dimensional Process Model for Chemimechanical Polish Planarization

J. Warnock · Journal of The Electrochemical Society · 1991 · 106 citations

, , +9