Nitesh Kumbhat

Through-package-via formation and metallization of glass interposers

Vijay Sukumaran, Qiao Chen, Fuhan Liu et al. · 2010 · 119 citations

Engineering, Silicon Interposers, Glass-ceramic +17

Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Vijay Sukumaran, Tapobrata Bandyopadhyay, Qiao Chen et al. · 2011 · 81 citations

Package Vias, Engineering, Fine Pitch +21

The Effect of Nozzle Diameter, Lance Height and Flow Rate on Penetration Depth in a Top-blown Water Model

Annie Nordquist, Nitesh Kumbhat, Lage Jonsson et al. · steel research international · 2006 · 61 citations

Nozzle Diameter, Engineering, Fluid Properties +13

Trend from ICs to 3D ICs to 3D systems

Rao Tummala, Venky Sundaram, Ritwik Chatterjee et al. · 2009 · 57 citations

Engineering, Computer Architecture, 3D Modeling +18

Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications

Fuhan Liu, Venky Sundaram, Sung-Hwan Min et al. · 2010 · 31 citations

Engineering, Organic Electronics, Integrated Circuits +24