Noriaki Oda

Reduction effect of line edge roughness on time-dependent dielectric breakdown lifetime of Cu/low-k interconnects by using CF3I etching

E. Soda, Noriaki Oda, Sanae Ito et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2009 · 27 citations

Engineering, Electrical Engineering, Materials Science +17

CMOS device optimization for system-on-a-chip applications

Kazuo Imai, Koji Yamaguchi, Tomoaki Kudo et al. · 2002 · 15 citations

Engineering, Computer Engineering, Electrical Engineering +17

Feasibility Study of 45-nm-Node Scaled-Down Cu Interconnects With Molecular-Pore-Stacking (MPS) SiOCH Films

Munehiro Tada, Hiroto Ohtake, Fuminori Ito et al. · IEEE Transactions on Electron Devices · 2007 · 14 citations

Engineering, Electrical Engineering, Materials Engineering +17

Applicability of extreme ultraviolet lithography to fabrication of half pitch 35nm interconnects

Hajime Aoyama, Yuusuke Tanaka, Kazuo Tawarayama et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2010 · 13 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Electromigration Lifetime Enhancement of CoWP Capped Cu Interconnects by Thermal Treatment

Y. Kakuhara, Naoyoshi Kawahara, Kazuyoshi Ueno et al. · Japanese Journal of Applied Physics · 2008 · 13 citations

Natural Sciences, Electrical Engineering, Materials Science +15