E. Soda

Reduction effect of line edge roughness on time-dependent dielectric breakdown lifetime of Cu/low-k interconnects by using CF3I etching

E. Soda, Noriaki Oda, Sanae Ito et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2009 · 27 citations

Engineering, Electrical Engineering, Materials Science +17

Highly selective low-damage processes using advanced neutral beams for porous low-k films

Hiroto Ohtake, Nobuhiko Inoue, Takuya Ozaki et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2005 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +15

Low-damage low-k etching with an environmentally friendly CF3I plasma

E. Soda, Seiichi Kondo, Shuichi Saito et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2008 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +16

Ultrathin pore-seal film by plasma enhanced chemical vapor deposition SiCH from tetramethylsilane

Akira Furuya, Katsumi Yoneda, E. Soda et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2005 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +17

Etch-Byproduct Pore Sealing for Atomic-Layer-Deposited-TaN Deposition on Porous Low-k Film

Akira Furuya, E. Soda, Miyoko Shimada et al. · Japanese Journal of Applied Physics · 2005 · 20 citations

Engineering, Materials Engineering, Materials Science +13