Kazuyoshi Ueno

Advanced Metallization Conference 2008

Maya Naik, R. Shariv, Tsuyoshi Yoda et al. · 2009 · 145 citations

Materials Science, Materials Engineering, Engineering +4

On-chip intercalated-graphene inductors for next-generation radio frequency electronics

Jiahao Kang, Yuji Matsumoto, Xiang Li et al. · Nature Electronics · 2018 · 110 citations

Electrical Engineering, Engineering, Nanoelectronics +3

Seed layer dependence of room-temperature recrystallization in electroplated copper films

Kazuyoshi Ueno, Tom Ritzdorf, S.Grace S.Grace · Journal of Applied Physics · 1999 · 65 citations

Materials Engineering, Materials Science, Engineering +13

Electroless Nickel Ternary Alloy Deposition on SiO[sub 2] for Application to Diffusion Barrier Layer in Copper Interconnect Technology

Tetsuya Ōsaka, Nao Takano, T. Kurokawa et al. · Journal of The Electrochemical Society · 2002 · 55 citations

Engineering, Electrode-electrolyte Interface, Thin Film Process Technology +19

Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

Tetsuya Ōsaka, Nao Takano, T. Kurokawa et al. · Surface and Coatings Technology · 2003 · 53 citations

Materials Engineering, Materials Science, Electrical Engineering +12