T. Kurokawa

Electroless Nickel Ternary Alloy Deposition on SiO[sub 2] for Application to Diffusion Barrier Layer in Copper Interconnect Technology

Tetsuya Ōsaka, Nao Takano, T. Kurokawa et al. · Journal of The Electrochemical Society · 2002 · 55 citations

Engineering, Electrode-electrolyte Interface, Thin Film Process Technology +19

Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

Tetsuya Ōsaka, Nao Takano, T. Kurokawa et al. · Surface and Coatings Technology · 2003 · 53 citations

Materials Engineering, Materials Science, Electrical Engineering +12

Fabrication of Electroless NiReP Barrier Layer on SiO[sub 2] Without Sputtered Seed Layer

Tetsuya Ōsaka, Nao Takano, T. Kurokawa et al. · Electrochemical and Solid-State Letters · 2002 · 42 citations

New Fabrication Process, Engineering, Electrode-electrolyte Interface +17

Tradeoff Characteristics Between Resistivity and Reliability for Scaled-Down Cu-Based Interconnects

Shinji Yokogawa, Kuniko Kikuta, Hideaki Tsuchiya et al. · IEEE Transactions on Electron Devices · 2008 · 28 citations

Engineering, Impurity Doping, Interconnect (Integrated Circuits) +16

A linearizer for satellite communications

Gunkichi Sato, Takehiko Asai, H. Shibazaki et al. · International Conference on Communications · 1980 · 14 citations

Engineering, Satellite Signal Processing, Satellite Communication +4