Publication | Closed Access
FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration
21
Citations
8
References
2015
Year
3D Ic ArchitectureElectrical EngineeringEngineeringVlsi DesignAdvanced Packaging (Semiconductors)NanoelectronicsBias Temperature InstabilityApplied PhysicsElectronic PackagingMicroelectronics3D IntegrationMonolithic Integration
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