F. Nemouchi

3DVLSI with CoolCube process: An alternative path to scaling

P. Batude, C. Fenouillet-Béranger, L. Pasini et al. · 2015 · 134 citations

Engineering, Vlsi Design, Computer Architecture +23

Differential scanning calorimetry analysis of the linear parabolic growth of nanometric Ni silicide thin films on a Si substrate

F. Nemouchi, D. Mangelinck, C. Bergman et al. · Applied Physics Letters · 2005 · 73 citations

Si Substrate, Engineering, Crystal Growth Technology +18

3D Sequential Integration: Application-driven technological achievements and guidelines

P. Batude, Laurent Brunet, C. Fenouillet-Béranger et al. · 2017 · 73 citations

Contact Pitch, Engineering, 3D Modeling +26

3D monolithic integration: Technological challenges and electrical results

M. Vinet, P. Batude, C. Tabone et al. · Microelectronic Engineering · 2010 · 65 citations

3D Ic Architecture, Engineering, Advanced Packaging (Semiconductors) +5

Hybrid III–V/Silicon Technology for Laser Integration on a 200-mm Fully CMOS-Compatible Silicon Photonics Platform

Bertrand Szelag, Karim Hassan, Laetitia Adelmini et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2019 · 63 citations

Optical Materials, Engineering, Device Integration +19