N. Rambal

3DVLSI with CoolCube process: An alternative path to scaling

P. Batude, C. Fenouillet-Béranger, L. Pasini et al. · 2015 · 134 citations

Engineering, Vlsi Design, Computer Architecture +23

Vertically stacked-NanoWires MOSFETs in a replacement metal gate process with inner spacer and SiGe source/drain

Sylvain Barraud, V. Lapras, Marie-Pierre Samson et al. · 2016 · 108 citations · Full text

Engineering, Inner Spacer, Integrated Circuits +16

Strong coupling between a photon and a hole spin in silicon

Cécile X. Yu, Simon Zihlmann, J. C. Abadillo-Uriel et al. · Nature Nanotechnology · 2023 · 96 citations

Photonics, Quantum Science, Spintronics +9

3D Sequential Integration: Application-driven technological achievements and guidelines

P. Batude, Laurent Brunet, C. Fenouillet-Béranger et al. · 2017 · 73 citations

Contact Pitch, Engineering, 3D Modeling +26

New insights on bottom layer thermal stability and laser annealing promises for high performance 3D VLSI

C. Fenouillet-Béranger, B. Mathieu, B. Prévitali et al. · 2014 · 56 citations

Engineering, Vlsi Design, New Insights +20