Effect of temperature on the electrical conduction and dielectric behavior of solder

Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

J.H.L. Pang, T.H. Low, B.S. Xiong et al. · Thin Solid Films · 2004 · 198 citations

Natural Sciences, Materials Engineering, Materials Science +9

Nonuniversality of the Mooij Correlation—the Temperature Coefficient of Electrical Resistivity of Disordered Metals

C. C. Tsuei · Physical Review Letters · 1986 · 156 citations

Natural Sciences, Materials Science, Physics +17

Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

P.L. Tu, Y.C. Chan, J.K.L. Lai · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

Weiqun Peng, Eduardo Franco de Monlevade, Marco E. Marques · Microelectronics Reliability · 2007 · 149 citations

Natural Sciences, Materials Engineering, Materials Science +14

A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints

D. R. Frear, D. Grivas, J. W. Morris · Journal of Electronic Materials · 1988 · 135 citations

Engineering, Materials Engineering, Materials Science +15