Publication | Closed Access
A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints
135
Citations
15
References
1988
Year
Materials ScienceEngineeringThermal Fatigue Failures60Sn-40pb Solder JointsHardware ReliabilityPhysic Of FailureMicrostructural StudyEngineering Failure AnalysisElectronic PackagingThermomechanical AnalysisThermal EngineeringLow-cycle FatigueMechanics Of MaterialsMicrostructure
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