IEEE Electron Device Letters · 2019 · 35 citations · 7 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationHigh-frequency Semiconductor DevicesSemiconductor Device MaterialsWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsCell Topology DesignPower MosfetsSilicon CarbideSilicon Carbide (Sic) MaterialsSilicon Carbide High-frequency DevicesSilicon Carbide Power DevicesSilicon Carbide Power Electronics
This letter compares the measured electrical characteristics of 600 V planar-gate inversion-channel 4H-SiC power MOSFETs fabricated with four different cell topologies (Linear, Square, Hexagonal, and Octagonal) for the first time. The High-Frequency Figures-of-Merit (HF-FOMs) of these devices were compared with the commercially available SiC device and the Si CoolMOS product. It was found that the HF-FOMs of the 600-V SiC product and our fabricated conventional Linear cell device are much worse in comparison to the Si CoolMOS product. However, the 600 V SiC power MOSFET with comparable performance to the Si CoolMOS product could be achieved by using the Octagonal cell topology.
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SiC MOSFET design considerations for reliable high voltage operation
P. A. Losee, Alexander Bolotnikov, Lihua Yu et al. · 2017 · 38 citations
Engineering, Electrical Engineering, Electronic Materials +12