Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

Abstract

Flexible displays and electronics are emerging technology. A PET substrate is one the strong candidate substrate materials for the applications, however, its low thermal stability limited its penetration depth in the market. We propose the interconnection process using laser and hybrid underfill as a technical solution to prevent the thermal deformation of a PET film during the interconnection process. The LED module array is successfully fabricated on a PET substrate using laser and hybrid underfill. The process features a very short cycle time and tiling process for the high throughput.