Characterization of polymer matrix and low melting point solder for anisotropic conductive film

Time‐cure‐temperature superposition for the prediction of instantaneous viscoelastic properties during cure

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Engineering, Mechanical Engineering, Thermoplastic Composite +18

Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection

Jong‐Woong Kim, Won-Chul Moon, Seung‐Boo Jung · Microelectronic Engineering · 2006 · 27 citations

Thermo-mechanical Reliability, Electrical Engineering, Engineering +10

Novel interconnection method using electrically conductive paste with fusible filler

Jong‐Min Kim, Kiyokazu Yasuda, Kozo Fujimoto · Journal of Electronic Materials · 2005 · 26 citations

Materials Science, Electrical Engineering, Engineering +7

Isotropic conductive adhesives with fusible filler particles

Jong‐Min Kim, Kiyokazu Yasuda, Kozo Fujimoto · Journal of Electronic Materials · 2004 · 22 citations

Materials Science, Engineering, Adhesive Material +5

ELECTRICAL PROPERTIES OF SOLDER FILLED ANISOTROPICALLY CONDUCTIVE ADHESIVES

Petri Savolainen, J.K. Kivilahti · Journal of Electronics Manufacturing · 1995 · 16 citations

Materials Science, Materials Engineering, Conductive Adhesives +14